On March 5, 2024, STMicroelectronics, a globally leading semiconductor company serving various electronic applications, announced the launch of a versatile dToF (direct Time-of-Flight) 3D radar module with excellent 2.3k resolution. Additionally, they revealed that the ultra-compact 500,000-pixel iToF (indirect Time-of-Flight) sensor received its first order.
The newly launched product is a direct ToF (Time-of-Flight) 3D laser radar chip with a high resolution of up to 2300 detection zones. This LiDAR radar, integrating dual-scan flood illumination, is unique in the market, capable of detecting small objects and edges, and capturing 2D infrared (IR) images and 3D depth map information. It is a directly usable low-power module with on-chip dToF processing capabilities, eliminating the need for additional external components or calibration processes. Additionally, the chip offers a ranging capability within the range of 5 centimeters to 10 meters.
The features of VL53L9 enhance camera-assisted autofocus performance, supporting macro to telephoto photography. This enables static images and videos shot at 60 frames per second to have laser autofocus, defocusing, and cinematic effects. Virtual Reality (VR) systems leverage accurate depth and 2D images to improve the accuracy of 3D reconstruction, enhancing the immersive feel of games and virtual reality experiences, for example, virtual tours or 3D avatars. Additionally, the capability to detect small object edges at both close and far distances makes this sensor suitable for applications such as virtual reality or Simultaneous Localization and Mapping (SLAM).
STMicroelectronics has also announced news about its ToF (Time-of-Flight) sensors. The product has entered mass production and signed its first supply contract with Bluecore Technology, a Chinese professional development company for mobile robot depth vision systems. A subsidiary of Bluecore Technology, MRDVS, has selected the VD55H1 to enhance the depth perception accuracy of its 3D cameras. This high-performance, compact camera integrates STMicroelectronics' sensor, combining 3D vision capabilities and edge artificial intelligence to provide intelligent obstacle avoidance and high-precision docking functions for mobile robots.
In addition to machine vision, the VD55H1 is well-suited for various applications such as 3D network cameras, PCs, VR headsets for 3D reconstruction, personnel counting, and activity detection in smart homes and buildings. This sensor integrates 672 x 804 perception pixels on a miniature chip, accurately mapping three-dimensional surfaces by measuring the distance to over 500,000 points. STMicroelectronics' backside illumination stacked wafer manufacturing process allows the sensor to achieve high resolution, making it smaller in chip size and lower in power consumption compared to similar iToF sensors in the market. This makes the sensor ideal for building 3D content for network cameras and virtual reality applications, including virtual avatars, hand modeling, and gaming.
The first batch of samples for VL53L9 has been released, and key customers can apply for samples. The plan is to start mass production in early 2025. VD55H1 is already in mass production.
Source：ednchina
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